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Silicas > Teslin > Applications > RFID & SmartCards
RFID & SmartCards
Teslin substrate enables cost effective production of durable, secure, high-performance ePassport inlays, smartcards and keytags, as well as RFID inlays, tags and labels, and cards.
Extended IC Service life — Delivering a unique combination of electronics cushioning, static dissipation, flexibility over a broad temperature range (-70₀C to 200₀C), and physical/chemical durability, Teslin substrate extends the service life of electronic cards and credentials.
Reduce Costs and Simplify Processing — The ability to print on both sides of Teslin substrate means verbiage, graphics, photos, and/or barcodes can be printed on the surface opposite incorporated electronics, allowing single-substrate inlay, RFID tag and label construction. Processing durability coupled with equipment and material compatibility provides potential yield improvement.
Enhanced Performance — Teslin substrate’s microporosity, superior adhesion, and low dielectric constant optimize performance in harsh RFID environments and facilitate design of distant read range systems and smaller form factors.
Strengthened Security — Teslin substrate is inherently tamper resistant and tamper evident. For added security, customized covert and forensic elements can be incorporated within Teslin substrate during production. This security-grade substrate is produced and sold within a controlled supply chain.
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| Recommended Product GradesDepending on your application and required level of security, choose from our traditional product line ( Teslin SP) or Teslin security-grade substrates. Both product lines are available in thicknesses from 6 mils / 152 microns to 18 mils / 457 microns and in rolls or sheets. Request product samples using our online form. |
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