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PPG Aerospace > Newsroom > News > 3-6-08
3-6-08
2008 is once again likely to be a busy year for trade show participation by the Semco® Packaging & Application Systems team!
We will return to the Apex show which has now relocated to Las Vegas. The following article is produced courtesy of the EMS Now website.
"IPC has announced it will move its international trade shows, IPC Printed Circuits Expo, APEX and the Designers Summit to the Mandalay Bay Resort and Convention Center, Las Vegas, Nev., in 2008.
The conference and exhibition will take place April 1-3, while other meetings and programs begin March 29.
"We are excited about moving our events to Mandalay Bay in Las Vegas. Mandalay Bay is a world-class convention center and hotel with sufficient space for the exhibition, technical conference and standard development committee meetings," Denny McGuirk, President of IPC said.
McGuirk explained that the change to Las Vegas was in response to the IPC Printed Circuits Expo and APEX exhibitors and attendees. "We listened to our members and they
expressed their dissatisfaction with Los Angeles as a venue for our events. We were fortunate that Mandalay Bay dates recently became available."
The move to Las Vegas has been unanimously approved by the IPC Board of Directors, the IPC PCB Suppliers Management Council and the IPC SMEMA Management Council steering committees and their two trade show subcommittees.
"In 2007, Los Angeles was really our only viable option when other convention cities like San Diego and Las Vegas had no available dates," said Jeffrey Timms, chairman of the
APEX trade show subcommittee and vice president of Sales & Marketing Americas, Siemens Energy & Automation, Inc., Electronics Assembly Systems. "Today, we've been
presented with a very positive option that should impact attendance very favorably. This combined with attendee feedback and exhibitor input, reaffirm that it makes sense to make this move at this time."
This is not the first time IPC has held an event in Las Vegas. IPC held its IPCWorks® program of conference and standards development meetings in October 2005 in Las
Vegas and experienced very strong attendance.
Statistics from a recent survey conducted by Exhibit Surveys Inc., an independent research firm, support the move. Eighty-seven percent of the trade shows participating in the survey experienced an increase in attendance when their respective events moved from another city to Las Vegas.
"The L.A. convention center is state-of-the-art, but the city doesn't yet meet our members' needs. We must remain focused on holding a successful event, and for now, that means a move to Las Vegas, " McGuirk concluded."
We look forward to seeing our West Coast Semco customers at this event.
 Come join Edison Zheng, Scott Ran and the Asia / Pacific Semco® Packaging and Application team in Shanghai, China on April 8-11th 2008 at the Everbright Convention
and Exhibition Center.
NEPCON China is the largest SMT trade event in Asia that features the most comprehensive range of innovative SMT products and technology. It brings the entire world of SMT to your door step that provides a platform to source for new suppliers, gather new market information and learn the latest technologies. The event targets industry professionals with buying power and helps your company meet its business goals and stay ahead of the competition in China.
NEPCON China is the largest SMT trade event in Asia that features the most comprehensive range of innovative SMT products and technology. It brings the entire world of SMT to your door step that provides a platform to source for new suppliers, gather new market information and learn about the latest technologies.
- Over the 4 days event, NEPCON China brings the key players together in Shanghai to exchange ideas, generate new contacts and present latest technologies.
- A selection of prestigious companies, such as Agilent, American Tec, Ascentek, Assembleon, DEK, First Technology, Fuji, Heller, Hitachi, Indium, Kasion, Kester, KIC, Mydata, Nutek Pte Ltd, Omron, Panasonic, Saki, Samsung, Semco, Shriro, Siemens, Smartech, Speedline, Sun East, Tokyo Juki, Universal, WKK China Ltd. will display some of the most cutting-edge technology on the market today. The show will open up an arena for local industry players to glean valuable knowledge about this dynamic industry from international heavyweights and hear about the latest products on the electronics manufacturing market
- 650 Exhibitors from 22 countries
- A total of 32,000 exhibition space
- 4 National Pavilions (Germany, UK, Korea, Singapore)
- Total attendance of 14,806 trade professionals
- Over four tracks of seminars and events, generating unprecedented attendance levels
 April 20-23 2008, Florida - World Adhesive Conference and Exposition 2008
Come join Allen Johnson and the Semco® Packaging and Application team along with global industry leaders, including representatives from FEICA (Europe), ASMAC (Canada), JAIA (Japan), CNAIA (China), IASA (India), ANIQ (Mexico) and other international organizations. Attend sessions addressing the latest trends in technology, business and management issues, regional market updates, and end-use market perspectives. Experience the world's largest adhesive and sealant industry exposition, featuring raw material and equipment suppliers, industry consultants and many other exhibitors
Please join Jim Enochs and Barry Wolf from Semco® Packaging a& Application Systems, April 30th to May 1st in booth 449 for the Del Mar Electronics tradeshow. Del Mar Fairgounrds, San Diego, CA
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